Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9717146 | Circuit module such as a high-density lead frame array (HDA) power module, and method of making same | Jian Yin, Nikhil Vishwanath Kelkar, Loyde M. Carpenter, Jr., Patrick J. Selby, Steven R. Rivet +1 more | 2017-07-25 |