Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721874 | Pre-encapsulated lead frames for microelectronic device packages, and associated methods | Ai Chie Wang, Choon Kuan Lee, Chin Hui Chong | 2017-08-01 |
WT
Wuu Yean Tay
Overall (2017): #195,578 of 506,227Top 40%
1
Patents 2017