Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721874 | Pre-encapsulated lead frames for microelectronic device packages, and associated methods | Choon Kuan Lee, Chin Hui Chong, Wuu Yean Tay | 2017-08-01 |
AW
Ai Chie Wang
Overall (2017): #501,282 of 506,227Top 100%
1
Patents 2017