Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768121 | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices | David J. Corisis, Chin Hui Chong | 2017-09-19 |
| 9721874 | Pre-encapsulated lead frames for microelectronic device packages, and associated methods | Ai Chie Wang, Chin Hui Chong, Wuu Yean Tay | 2017-08-01 |
| 9640458 | Stacked microelectronic devices | Seng Kim Ye, Chin Hui Chong, Wang Lai Lee, Roslan Bin Said | 2017-05-02 |