Issued Patents 2017
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9714473 | Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures | Uri Frodis, Adam L. Cohen | 2017-07-25 |
| 9671429 | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties | Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen +2 more | 2017-06-06 |
| 9620834 | Method for fabricating miniature structures or devices such as RF and microwave components | Elliott R. Brown, John D. Evans, Christopher A. Bang, Adam L. Cohen, Dennis R. Smalley +1 more | 2017-04-11 |
| 9614266 | Miniature RF and microwave components and methods for fabricating such components | Elliott R. Brown, John D. Evans, Christopher A. Bang, Adam L. Cohen, Dennis R. Smalley +1 more | 2017-04-04 |
| 9597834 | Electrochemical fabrication method including elastic joining of structures | Adam L. Cohen, Vacit Arat, Dennis R. Smalley | 2017-03-21 |
| 9567687 | Method of electrochemically fabricating multilayer structures having improved interlayer adhesion | Gang Zhang, Adam L. Cohen, Ananda H. Kumar, Ezekiel J. J. Kruglick, Kieun Kim | 2017-02-14 |
| 9567682 | Counterfeiting deterrent and security devices, systems, and methods | Gregory P. Schmitz, Ming Ting Wu, Eric C. Miller, Adam L. Cohen | 2017-02-14 |
| 9546431 | Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates | Adam L. Cohen, Kieun Kim, Qui T. Le, Gang Zhang, Uri Frodis +2 more | 2017-01-17 |
| 9540233 | Methods of forming three-dimensional structures having reduced stress and/or curvature | Ananda H. Kumar, Jorge Sotelo Albarran, Adam L. Cohen, Kieun Kim, Uri Frodis +1 more | 2017-01-10 |
| 9533376 | Methods of forming parts using laser machining | Arun S. Veeramani, Heath A. Jensen, Uri Frodis, Christopher G. Wiita, Irina Boguslavsky +3 more | 2017-01-03 |