Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9567687 | Method of electrochemically fabricating multilayer structures having improved interlayer adhesion | Gang Zhang, Adam L. Cohen, Michael S. Lockard, Ananda H. Kumar, Kieun Kim | 2017-02-14 |