Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9671429 | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties | Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Adam L. Cohen, Ananda H. Kumar +2 more | 2017-06-06 |
| 9567687 | Method of electrochemically fabricating multilayer structures having improved interlayer adhesion | Gang Zhang, Adam L. Cohen, Michael S. Lockard, Ananda H. Kumar, Ezekiel J. J. Kruglick | 2017-02-14 |
| 9546431 | Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates | Adam L. Cohen, Michael S. Lockard, Qui T. Le, Gang Zhang, Uri Frodis +2 more | 2017-01-17 |
| 9540233 | Methods of forming three-dimensional structures having reduced stress and/or curvature | Ananda H. Kumar, Jorge Sotelo Albarran, Adam L. Cohen, Michael S. Lockard, Uri Frodis +1 more | 2017-01-10 |