Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9716040 | Wafer processing method using adhesive tape to pick up device chips | Hideki Koshimizu, Yurika Araya, Tetsukazu Sugiya | 2017-07-25 |
| 9680094 | Memory device and method for manufacturing the same | Shosuke Fujii | 2017-06-13 |