Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9716040 | Wafer processing method using adhesive tape to pick up device chips | Takashi Haimoto, Yurika Araya, Tetsukazu Sugiya | 2017-07-25 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9716040 | Wafer processing method using adhesive tape to pick up device chips | Takashi Haimoto, Yurika Araya, Tetsukazu Sugiya | 2017-07-25 |