Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852949 | Wafer processing method | Xin Lu | 2017-12-26 |
| 9786509 | Wafer processing method | Ryosuke Nishihara, Minoru Matsuzawa, Kohei TSUJIMOTO | 2017-10-10 |
| 9716040 | Wafer processing method using adhesive tape to pick up device chips | Takashi Haimoto, Hideki Koshimizu, Yurika Araya | 2017-07-25 |