Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9640413 | Etching-before-packaging horizontal chip 3D system-level metal circuit board structure and technique thereof | Steve Xin Liang, Yu-Bin Lin, Yaqin Wang, Youhai Zhang | 2017-05-02 |
| 9633985 | First-etched and later-packaged three-dimensional system-in-package normal chip stack package structure and processing method thereof | Yaqin Wang, Chunyan Zhang, Yu-Bin Lin, Youhai Zhang | 2017-04-25 |