Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9640413 | Etching-before-packaging horizontal chip 3D system-level metal circuit board structure and technique thereof | Chih-Chung Liang, Yu-Bin Lin, Yaqin Wang, Youhai Zhang | 2017-05-02 |