Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9633985 | First-etched and later-packaged three-dimensional system-in-package normal chip stack package structure and processing method thereof | Chih-Chung Liang, Yaqin Wang, Yu-Bin Lin, Youhai Zhang | 2017-04-25 |
| 9594124 | Battery charge meter testing | Tue Fatt David Wee, Yiming Tang, Siow Kiat Tan | 2017-03-14 |