Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9764364 | Apparatus and methods for movable megasonic wafer probe | Chin-Hsiang Lin, Chi-Ming Yang, Ming-Hsi Yeh, Shao-Yen Ku | 2017-09-19 |
| 9564509 | Method of fabricating an integrated circuit device | Ming-Hsi Yeh, Hsien-Hsin Lin, Yi-Fang Pai, Chi-Ming Yang, Chin-Hsiang Lin | 2017-02-07 |