Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9633839 | Methods for depositing dielectric films via physical vapor deposition processes | Weimin Zeng, Thanh X. Nguyen, Yong Cao, Daniel Lee Diehl, Srinivas Guggilla +2 more | 2017-04-25 |
| 9601431 | Dielectric/metal barrier integration to prevent copper diffusion | He Ren, Mehul Naik, Yong Cao, Mei-Yee Shek, Sree Rangasai V. Kesapragada | 2017-03-21 |