TC

Tien-Jen Cheng

IBM: 4 patents #1,576 of 10,852Top 15%
📍 Bedford, NY: #1 of 6 inventorsTop 20%
🗺 New York: #1,173 of 12,278 inventorsTop 10%
Overall (2017): #36,290 of 506,227Top 8%
4
Patents 2017

Issued Patents 2017

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
9673176 Metal to metal bonding for stacked (3D) integrated circuits Mukta G. Farooq, John A. Fitzsimmons 2017-06-06
9666563 Metal to metal bonding for stacked (3D) integrated circuits Mukta G. Farooq, John A. Fitzsimmons 2017-05-30
9653431 Metal to metal bonding for stacked (3D) integrated circuits Mukta G. Farooq, John A. Fitzsimmons 2017-05-16
9653432 Metal to metal bonding for stacked (3D) integrated circuits Mukta G. Farooq, John A. Fitzsimmons 2017-05-16