Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852973 | Manufacturing method of chip package and package substrate | Wen-Sung Hsu | 2017-12-26 |
| 9633936 | Semiconductor package | Wen-Sung Hsu, Tzu-Hung Lin | 2017-04-25 |
| 9627311 | Chip package, package substrate and manufacturing method thereof | Wen-Sung Hsu | 2017-04-18 |
| 9553040 | Semiconductor package | Wen-Sung Hsu, Tzu-Hung Lin | 2017-01-24 |