Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831169 | Integrated circuit package substrate | Qinglei Zhang | 2017-11-28 |
| 9548264 | High density organic bridge device and method | Mihir K. Roy, Wei-Lun Kane Jen | 2017-01-17 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831169 | Integrated circuit package substrate | Qinglei Zhang | 2017-11-28 |
| 9548264 | High density organic bridge device and method | Mihir K. Roy, Wei-Lun Kane Jen | 2017-01-17 |