Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837396 | Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods | Sameer S. Vadhavkar, Xiao Li, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2017-12-05 |
| 9818625 | Stacked semiconductor die assemblies with thermal spacers and associated systems and methods | Jian Li, Michel Koopmans | 2017-11-14 |
| 9780079 | Semiconductor die assembly and methods of forming thermal paths | Jian Li | 2017-10-03 |
| 9691746 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Sameer S. Vadhavkar, Xiao Li, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2017-06-27 |
| 9543274 | Semiconductor device packages with improved thermal management and related methods | Jian Li, Shijian Luo | 2017-01-10 |