Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768155 | Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP | Yaojian Lin, Kang Chen | 2017-09-19 |
| 9704769 | Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP) | Thomas Strothmann, Yaojian Lin | 2017-07-11 |
| 9640603 | Semiconductor device and method of forming inductor over insulating material filled trench in substrate | Meenakshi Padmanathan, YongTaek Lee | 2017-05-02 |
| 9620413 | Semiconductor device and method of using a standardized carrier in semiconductor packaging | Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz +1 more | 2017-04-11 |