Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768144 | Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate | Albert Wu, Roawen Chen, Chung Chyung Han, Shiann-Ming Liou, Chien-Chuan Wei +2 more | 2017-09-19 |
| 9659851 | Method and apparatus for improving the reliability of a connection to a via in a substrate | Long Wang, Albert Wu | 2017-05-23 |
| 9610811 | Tire tool | — | 2017-04-04 |
| 9587633 | Portable pump capable of transmitting air pressure value via wireless transmission to mobile electronic device for indication | — | 2017-03-07 |