Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768144 | Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate | Albert Wu, Roawen Chen, Chung Chyung Han, Chien-Chuan Wei, Runzi Chang +2 more | 2017-09-19 |
| 9666510 | Dual row quad flat no-lead semiconductor package | Chenglin Liu, Sheng C. Liao | 2017-05-30 |
| 9666571 | Package-on-package structures | Huahung Kao | 2017-05-30 |
| 9543236 | Pad configurations for an electronic package assembly | Sehat Sutardja, Huahung Kao | 2017-01-10 |