Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768144 | Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate | Albert Wu, Roawen Chen, Shiann-Ming Liou, Chien-Chuan Wei, Runzi Chang +2 more | 2017-09-19 |