Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704781 | Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods | Brandon P. Wirz, Jaspreet S. Gandhi, Christopher J. Gambee | 2017-07-11 |
SY
Satish Yeldandi
Overall (2017): #251,896 of 506,227Top 50%
1
Patents 2017