Issued Patents 2017
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818653 | Semiconductor TSV device package to which other semiconductor device package can be later attached | David J. West | 2017-11-14 |
| 9754911 | IC structure with angled interconnect elements | David J. West, Charles H. Wilson | 2017-09-05 |
| 9741695 | Three-dimensional hybrid packaging with through-silicon-vias and tape-automated-bonding | Sebastian T. Ventrone | 2017-08-22 |
| 9721852 | Semiconductor TSV device package to which other semiconductor device package can be later attached | David J. West | 2017-08-01 |
| 9659835 | Techniques for integrating thermal via structures in integrated circuits | Jeffrey P. Gambino, Sundeep Mandal | 2017-05-23 |
| 9608403 | Dual bond pad structure for photonics | Jeffrey P. Gambino, Robert K. Leidy, Jeffrey C. Maling | 2017-03-28 |
| 9585257 | Method of forming a glass interposer with thermal vias | Jeffrey P. Gambino, Sudeep Mandal, David J. Russell | 2017-02-28 |
| 9570422 | Semiconductor TSV device package for circuit board connection | David J. West | 2017-02-14 |
| 9559283 | Integrated circuit cooling using embedded peltier micro-vias in substrate | Jeffrey P. Gambino, Sudeep Mandal | 2017-01-31 |
| 9536732 | Low temperature fabrication of lateral thin film varistor | Jeffrey P. Gambino, Sudeep Mandal | 2017-01-03 |