Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818653 | Semiconductor TSV device package to which other semiconductor device package can be later attached | Richard S. Graf | 2017-11-14 |
| 9754911 | IC structure with angled interconnect elements | Charles H. Wilson, Richard S. Graf | 2017-09-05 |
| 9721852 | Semiconductor TSV device package to which other semiconductor device package can be later attached | Richard S. Graf | 2017-08-01 |
| 9570422 | Semiconductor TSV device package for circuit board connection | Richard S. Graf | 2017-02-14 |