Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806017 | Flip-chip, face-up and face-down centerbond memory wirebond assemblies | Belgacem Haba, Wael Zohni | 2017-10-31 |
| 9728495 | Reconfigurable PoP | Belgacem Haba, Wael Zohni | 2017-08-08 |
| 9679838 | Stub minimization for assemblies without wirebonds to package substrate | Wael Zohni, Belgacem Haba, Frank Lambrecht | 2017-06-13 |
| 9679876 | Microelectronic package having at least two microelectronic elements that are horizontally spaced apart from each other | Wael Zohni, Belgacem Haba, Frank Lambrecht | 2017-06-13 |