Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831169 | Integrated circuit package substrate | Stefanie M. Lotz | 2017-11-28 |
| 9832883 | Integrated circuit package substrate | — | 2017-11-28 |
| 9735120 | Low z-height package assembly | Sri Ranga Sai Boyapati | 2017-08-15 |
| 9640485 | Bridge interconnection with layered interconnect structures | Yueli Liu, Amanda E. Schuckman, Rui Zhang | 2017-05-02 |