Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842808 | Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die | HanGil Shin, HeeJo Chi | 2017-12-12 |
| 9748157 | Integrated circuit packaging system with joint assembly and method of manufacture thereof | HeeJo Chi, HanGil Shin, Kyung-Moon Kim | 2017-08-29 |
| 9735113 | Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP | HeeJo Chi, Junwoo Myung | 2017-08-15 |
| 9730256 | Method and apparatus for discovering device in wireless communication network | Changsoon Kim, Byunghoon Seo, Jongmu Choi, Hakkwan Kim, Chanki Cho | 2017-08-08 |
| 9691707 | Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package | HeeJo Chi, HanGil Shin | 2017-06-27 |
| 9578494 | Method and apparatus for allocating IP address in wireless communication network | Jongmu Choi, Changsoon Kim, Hakkwan Kim | 2017-02-21 |
| 9558965 | Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint | HeeJo Chi, HanGil Shin | 2017-01-31 |