Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806063 | Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability | Chin-Kwan Kim, Rajneesh Kumar, Vladimir Noveski, Jie Fu, Ahmer Syed +1 more | 2017-10-31 |
| 9768108 | Conductive post protection for integrated circuit packages | Jie Fu, Chin-Kwan Kim, Manuel Aldrete, Dwayne Richard Shirley | 2017-09-19 |
| 9601435 | Semiconductor package with embedded components and method of making the same | Chin-Kwan Kim, David Fraser Rae, Rajneesh Kumar, Omar J. Bchir | 2017-03-21 |