Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837368 | Enhanced board level reliability for wafer level packages | Peter R. Harper, Arkadii V. Samoilov | 2017-12-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837368 | Enhanced board level reliability for wafer level packages | Peter R. Harper, Arkadii V. Samoilov | 2017-12-05 |