Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704978 | Integrated circuit heat dissipation using nanostructures | Alan B. Botula, James A. Slinkman, Theodore G. van Kessel, Randy L. Wolf | 2017-07-11 |
| 9685362 | Apparatus and method for centering substrates on a chuck | Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Matthew D. Moon +1 more | 2017-06-20 |
| 9666701 | Integrated circuit heat dissipation using nanostructures | Alan B. Botula, James A. Slinkman, Theodore G. van Kessel, Randy L. Wolf | 2017-05-30 |
| 9607929 | Tsv wafer with improved fracture strength | James W. Adkisson, Yoba Amoah, Jeffrey P. Gambino, Christine A. Leggett, Charles F. Musante +2 more | 2017-03-28 |
| 9601606 | Integrated circuit heat dissipation using nanostructures | Alan B. Botula, James A. Slinkman, Theodore G. van Kessel, Randy L. Wolf | 2017-03-21 |