Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9676619 | Method for wafer-level chip scale package testing | Yang Zhao, Piu Francis Man, Haidong Liu, Bin Li | 2017-06-13 |
| 9658298 | Monolithic three-axis magnetic field sensor | Yongyao Cai, Paul M. Zavracky, Yang Zhao, Shuo Gu | 2017-05-23 |