Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9676619 | Method for wafer-level chip scale package testing | Yang Zhao, Piu Francis Man, Leyue Jiang, Bin Li | 2017-06-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9676619 | Method for wafer-level chip scale package testing | Yang Zhao, Piu Francis Man, Leyue Jiang, Bin Li | 2017-06-13 |