Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9682854 | Wafer level chip scale packaged micro-electro-mechanical-system (MEMS) device and methods of producing thereof | Anru Andrew Cheng | 2017-06-20 |
| 9676619 | Method for wafer-level chip scale package testing | Yang Zhao, Leyue Jiang, Haidong Liu, Bin Li | 2017-06-13 |