Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773714 | Semiconductor package resin composition and usage method thereof | Hiroko Akiyama, Naota Sugiyama, Brant U. Kolb, Eric G. Larson | 2017-09-26 |
KK
Kohichiro Kawate
Overall (2017): #343,068 of 506,227Top 70%
1
Patents 2017