Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773714 | Semiconductor package resin composition and usage method thereof | Kohichiro Kawate, Naota Sugiyama, Brant U. Kolb, Eric G. Larson | 2017-09-26 |
HA
Hiroko Akiyama
Overall (2017): #403,732 of 506,227Top 80%
1
Patents 2017