Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773714 | Semiconductor package resin composition and usage method thereof | Kohichiro Kawate, Hiroko Akiyama, Naota Sugiyama, Brant U. Kolb | 2017-09-26 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773714 | Semiconductor package resin composition and usage method thereof | Kohichiro Kawate, Hiroko Akiyama, Naota Sugiyama, Brant U. Kolb | 2017-09-26 |