Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9773714 | Semiconductor package resin composition and usage method thereof | Kohichiro Kawate, Hiroko Akiyama, Naota Sugiyama, Brant U. Kolb | 2017-09-26 | $35,188,000 |