KE

Keiichi Endoh

DC Dowa Electronics Materials Co.: 2 patents #1 of 45Top 3%
Overall (2017): #134,236 of 506,227Top 30%
2
Patents 2017

Issued Patents 2017

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9662748 Metal nanoparticle dispersion, method for producing metal nanoparticle dispersion, and bonding method Hiromasa Miyoshi, Takashi Hinotsu, Satoru Kurita, Yoshiko Kohno 2017-05-30
9533380 Bonding material and bonding method in which said bonding material is used Satoru Kurita, Minami Nagaoka 2017-01-03