Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831157 | Method of attaching an electronic part to a copper plate having a surface roughness | Naoya Sunachi, Hideyo Osanai | 2017-11-28 |
| 9662748 | Metal nanoparticle dispersion, method for producing metal nanoparticle dispersion, and bonding method | Keiichi Endoh, Hiromasa Miyoshi, Takashi Hinotsu, Yoshiko Kohno | 2017-05-30 |
| 9533380 | Bonding material and bonding method in which said bonding material is used | Keiichi Endoh, Minami Nagaoka | 2017-01-03 |