HO

Hideyo Osanai

DC Dowa Metaltech Co.: 2 patents #2 of 13Top 20%
Overall (2017): #147,779 of 506,227Top 30%
2
Patents 2017

Issued Patents 2017

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9831157 Method of attaching an electronic part to a copper plate having a surface roughness Naoya Sunachi, Satoru Kurita 2017-11-28
9713253 Metal/ceramic bonding substrate and method for producing same Takayuki Takahashi, Satoru Ideguchi, Hirotaka Kotani 2017-07-18