MN

Minami Nagaoka

DC Dowa Electronics Materials Co.: 1 patents #8 of 45Top 20%
📍 Okayama, JP: #25 of 119 inventorsTop 25%
Overall (2017): #305,567 of 506,227Top 65%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9533380 Bonding material and bonding method in which said bonding material is used Keiichi Endoh, Satoru Kurita 2017-01-03