Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831282 | Electronic device package and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha +1 more | 2017-11-28 |
| 9633966 | Stacked semiconductor package and manufacturing method thereof | Dong Joo Park, Jae Sung Park, Jin Seong Kim | 2017-04-25 |
| 9627348 | Laser assisted bonding for semiconductor die interconnections | Dong Su Ryu, Choon Heung Lee, Min Ho Kim, Choong Hoe Kim, Chan Ha Hwang +1 more | 2017-04-18 |
| 9627368 | Semiconductor device using EMC wafer support system and fabricating method thereof | Jin Young Kim, Doo Hyun Park, Seong Min Seo, Glenn Rinne, Choon Heung Lee | 2017-04-18 |