Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837331 | Semiconductor device having overlapped via apertures | Jin Seong Kim, Kwang Ho Kim, Hee Yeoul Yoo, Jeong Wung Jeong | 2017-12-05 |
| 9728476 | Fingerprint sensor and manufacturing method thereof | Ji Young Chung, Jin Seong Kim, Jae Sung Park, Se Hwan Hong | 2017-08-08 |
| 9633966 | Stacked semiconductor package and manufacturing method thereof | Jae Sung Park, Jin Seong Kim, Ju Hoon Yoon | 2017-04-25 |