Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9647196 | Wafer-level package and method for production thereof | Christian Bauer, Hans Krueger, Alois Stelzl, Wolfgang Pahl, Robert Koch | 2017-05-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9647196 | Wafer-level package and method for production thereof | Christian Bauer, Hans Krueger, Alois Stelzl, Wolfgang Pahl, Robert Koch | 2017-05-09 |