Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9647196 | Wafer-level package and method for production thereof | Christian Bauer, Hans Krueger, Juergen Portmann, Alois Stelzl, Wolfgang Pahl | 2017-05-09 |
| 9577605 | RF component with reduced coupling and suitable for miniaturization | Jürgen Kiwitt, Maximilian Pitschi | 2017-02-21 |