Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9853204 | MEMS component and method for encapsulating MEMS components | Hans Kruger, Christian Bauer, Jürgen Portmann, Wolfgang Pahl | 2017-12-26 |
| 9647196 | Wafer-level package and method for production thereof | Christian Bauer, Hans Krueger, Juergen Portmann, Wolfgang Pahl, Robert Koch | 2017-05-09 |