Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852965 | Semiconductor devices with through electrodes and methods of fabricating the same | Ho-Jin Lee, Byung-Lyul Park, Kwangjin Moon, Jisoon Park | 2017-12-26 |
| 9847276 | Semiconductor devices having through-electrodes and methods for fabricating the same | Pil-Kyu Kang, Byung-Lyul Park, Sunghee KANG, Taeseong Kim, Taeyeong Kim +6 more | 2017-12-19 |
| 9824973 | Integrated circuit devices having through-silicon via structures and methods of manufacturing the same | Ho-Jin Lee, Byung-Lyul Park | 2017-11-21 |
| 9691685 | Semiconductor devices and methods of manufacturing the same, and semiconductor packages including the semiconductor devices | Kyu-Ha Lee, Hyung Jun Jeon, Jum-Yong Park, Byung-Lyul Park, Ji-Soon Park +1 more | 2017-06-27 |
| 9653430 | Semiconductor devices having stacked structures and methods for fabricating the same | Taeyeong Kim, Byung-Lyul Park, Seokho Kim, Pil-Kyu Kang, Hyoju Kim +1 more | 2017-05-16 |
| 9543250 | Semiconductor devices including through-silicon via | Byung-Lyul Park, Soyoung Lee, Gilheyun Choi | 2017-01-10 |