Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9685402 | Semiconductor device and method of forming recesses in conductive layer to detect continuity for interconnect between semiconductor die and substrate | CHIEN-CHEN LEE, Yi-Wen Huang, Ke Jung Jen | 2017-06-20 |
| 9627286 | Package structure | Kuo-Hsiung Li, Chi-Chih Shen, Jui-Cheng Chuang | 2017-04-18 |