Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9685402 | Semiconductor device and method of forming recesses in conductive layer to detect continuity for interconnect between semiconductor die and substrate | Jen-Yu Chen, CHIEN-CHEN LEE, Yi-Wen Huang | 2017-06-20 |